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Implications of the use of FPGAs in bare die form for high density packaging applications

dc.contributor.authorTruzzi, Claudio
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T11:44:35Z
dc.date.available2021-10-14T11:44:35Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3896
dc.sourceIIOimport
dc.titleImplications of the use of FPGAs in bare die form for high density packaging applications
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage555
dc.source.endpage561
dc.source.conferenceProceedings of the 12th European Microelectronics and Packaging Conference
dc.source.conferencedate7/06/1999
dc.source.conferencelocationHarrogate UK
imec.availabilityPublished - open access


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