Parametric compact models for flip chip assemblies

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Authors
Van Dooren, Sofie; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Corlatan, D.
Conference
5th International Workshop Thermal Investigations of ICs and Systems - THERMINIC
Title
Parametric compact models for flip chip assemblies
Publication type
Proceedings paper
Embargo date
9999-12-31
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