dc.contributor.author | Murakami, Hironaru | |
dc.contributor.author | Murakami, Fumikazu | |
dc.contributor.author | Serita, Kazunori | |
dc.contributor.author | Tonouchi, Masayoshi | |
dc.contributor.author | Jacobs, Kristof | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2022-03-04T13:42:16Z | |
dc.date.available | 2022-03-04T13:42:16Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 2520-1131 | |
dc.identifier.other | WOS:000632468400007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39308 | |
dc.source | WOS | |
dc.title | Characterization of through-silicon vias using laser terahertz emission microscopy | |
dc.type | Journal article | |
dc.contributor.imecauthor | Jacobs, Kristof | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidext | Tonouchi, Masayoshi::0000-0002-9284-3501 | |
dc.contributor.orcidimec | Jacobs, Kristof J. P.::0000-0002-1081-3633 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1038/s41928-021-00559-z | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 202 | |
dc.source.endpage | 207 | |
dc.source.journal | NATURE ELECTRONICS | |
dc.source.issue | 3 | |
dc.source.volume | 4 | |
imec.availability | Published - imec | |