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The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique

dc.contributor.authorVan Olmen, Jan
dc.contributor.authorManca, Jean
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorDe Schepper, Luc
dc.contributor.authorD'Haeger, V.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorMaex, Karen
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorTielemans, Luc
dc.date.accessioned2021-10-14T11:48:35Z
dc.date.available2021-10-14T11:48:35Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3940
dc.sourceIIOimport
dc.titleThe kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique
dc.typeJournal article
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage1657
dc.source.endpage1665
dc.source.journalMicroelectronics and Reliability
dc.source.issue11
dc.source.volume39
imec.availabilityPublished - imec


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