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Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T11:51:05Z
dc.date.available2021-10-14T11:51:05Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3965
dc.sourceIIOimport
dc.titleThermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage15
dc.source.endpage21
dc.source.journalMicroelectronics International
dc.source.issue3
dc.source.volume16
imec.availabilityPublished - open access


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