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Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package
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Authors
Vandevelde, Bart
;
Beyne, Eric
Issue
3
Journal
Microelectronics International
Volume
16
Title
Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package
Publication type
Journal article
Embargo date
9999-12-31
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