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Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package
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Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package
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Date
1999
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3934.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Beyne, Eric
Journal
Microelectronics International
Abstract
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1883
since deposited on 2021-10-14
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Acq. date: 2025-12-16
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Metrics
Views
1883
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-16
Citations