dc.contributor.author | Vanfleteren, Jan | |
dc.contributor.author | De Baets, Johan | |
dc.contributor.author | Van Calster, Andre | |
dc.contributor.author | Schols, G. | |
dc.contributor.author | Pergoot, N. | |
dc.contributor.author | Järvinen, E. | |
dc.contributor.author | Aintila, A. | |
dc.date.accessioned | 2021-10-14T11:51:41Z | |
dc.date.available | 2021-10-14T11:51:41Z | |
dc.date.issued | 1999 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3971 | |
dc.source | IIOimport | |
dc.title | Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.imecauthor | De Baets, Johan | |
dc.contributor.imecauthor | Van Calster, Andre | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 399 | |
dc.source.endpage | 404 | |
dc.source.conference | Proceedings of the 12th European Microelectronics and Packaging Conference | |
dc.source.conferencedate | 7/06/1999 | |
dc.source.conferencelocation | Harrogate UK | |
imec.availability | Published - open access | |