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Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies

dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVan Calster, Andre
dc.contributor.authorSchols, G.
dc.contributor.authorPergoot, N.
dc.contributor.authorJärvinen, E.
dc.contributor.authorAintila, A.
dc.date.accessioned2021-10-14T11:51:41Z
dc.date.available2021-10-14T11:51:41Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3971
dc.sourceIIOimport
dc.titleDesign, fabrication and bumping of test chips for development of fine pitch flip-chip technologies
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage399
dc.source.endpage404
dc.source.conferenceProceedings of the 12th European Microelectronics and Packaging Conference
dc.source.conferencedate7/06/1999
dc.source.conferencelocationHarrogate UK
imec.availabilityPublished - open access


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