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dc.contributor.authorLin, Hesheng
dc.date.accessioned2022-08-10T08:47:40Z
dc.date.available2022-05-20T02:20:30Z
dc.date.available2022-08-10T08:47:40Z
dc.date.issued2022-03-01
dc.identifier.issn2156-3950
dc.identifier.otherWOS:000792916300007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39854.2
dc.sourceWOS
dc.titleSystem Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor
dc.typeJournal article
dc.contributor.imecauthorLin, Hesheng
dc.contributor.orcidimecLin, Hesheng::0000-0002-7404-3156
dc.identifier.doi10.1109/TCPMT.2021.3102435
dc.source.numberofpages9
dc.source.peerreviewyes
dc.subject.disciplineElectrical & electronic engineering
dc.source.beginpage401
dc.source.endpage409
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.issue3
dc.source.volume12
imec.availabilityUnder review


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