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System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor
dc.contributor.author | Lin, Hesheng | |
dc.date.accessioned | 2022-08-10T08:47:40Z | |
dc.date.available | 2022-05-20T02:20:30Z | |
dc.date.available | 2022-08-10T08:47:40Z | |
dc.date.issued | 2022-03-01 | |
dc.identifier.issn | 2156-3950 | |
dc.identifier.other | WOS:000792916300007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39854.2 | |
dc.source | WOS | |
dc.title | System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor | |
dc.type | Journal article | |
dc.contributor.imecauthor | Lin, Hesheng | |
dc.contributor.orcidimec | Lin, Hesheng::0000-0002-7404-3156 | |
dc.identifier.doi | 10.1109/TCPMT.2021.3102435 | |
dc.source.numberofpages | 9 | |
dc.source.peerreview | yes | |
dc.subject.discipline | Electrical & electronic engineering | |
dc.source.beginpage | 401 | |
dc.source.endpage | 409 | |
dc.source.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | |
dc.source.issue | 3 | |
dc.source.volume | 12 | |
imec.availability | Under review |