Publication:

System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor

Date

2022-03-01
Journal article
https://doi.org/10.1109/TCPMT.2021.3102435
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Author(s)

Lin, Hesheng  
;
Van der Plas, Geert  
;
Sun, Xiao  
;
Velenis, Dimitrios  
;
Beyne, Eric  
;
Lauwereins, Rudy  

Journal

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

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1734 since deposited on 2022-05-20
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Acq. date: 2026-01-07

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