Publication:

System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor

Date

2022-03-01
Journal article
https://doi.org/10.1109/TCPMT.2021.3102435
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dc.contributor.authorLin, Hesheng
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorSun, Xiao
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorBeyne, Eric
dc.contributor.authorLauwereins, Rudy
dc.contributor.imecauthorLin, Hesheng
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLauwereins, Rudy
dc.contributor.orcidimecLin, Hesheng::0000-0002-7404-3156
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecLauwereins, Rudy::0000-0002-3861-0168
dc.date.accessioned2022-08-26T09:18:12Z
dc.date.available2022-05-20T02:20:30Z
dc.date.available2022-08-10T08:47:40Z
dc.date.available2022-08-26T09:18:12Z
dc.date.embargo9999-12-31
dc.date.issued2022-03-01
dc.identifier.doi10.1109/TCPMT.2021.3102435
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39854
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage401
dc.source.endpage409
dc.source.issue3
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages9
dc.source.volume12
dc.subject.disciplineElectrical & electronic engineering
dc.title

System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor

dc.typeJournal article
dspace.entity.typePublication
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