Notice

This item has not yet been validated by imec staff.

Notice

This is not the latest version of this item. The latest version can be found at: https://imec-publications.be/handle/20.500.12860/39854.3

Show simple item record

dc.contributor.authorLin, Hesheng
dc.contributor.authorvan der Plas, Geert
dc.contributor.authorSun, Xiao
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorBeyne, Eric
dc.contributor.authorLauwereins, Rudy
dc.date.accessioned2022-05-20T02:20:30Z
dc.date.available2022-05-20T02:20:30Z
dc.date.issued2022-MAR
dc.identifier.issn2156-3950
dc.identifier.otherWOS:000792916300007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39854
dc.sourceWOS
dc.titleSystem Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor
dc.typeJournal article
dc.contributor.imecauthorLin, Hesheng
dc.contributor.imecauthorvan der Plas, Geert
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLauwereins, Rudy
dc.contributor.orcidimecLin, Hesheng::0000-0002-7404-3156
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecLauwereins, Rudy::0000-0002-3861-0168
dc.identifier.doi10.1109/TCPMT.2021.3102435
dc.source.numberofpages9
dc.source.peerreviewyes
dc.source.beginpage401
dc.source.endpage409
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.issue3
dc.source.volume12
imec.availabilityUnder review


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record

VersionItemDateSummary

*Selected version