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Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
dc.contributor.author | Fei, Guanghai | |
dc.contributor.author | Nie, Lei | |
dc.contributor.author | Zhong, Lipeng | |
dc.contributor.author | Shi, Qimin | |
dc.contributor.author | Hu, Kehui | |
dc.contributor.author | Parra-Cabrera, Cesar | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Ameloot, Rob | |
dc.contributor.author | Yang, Shoufeng | |
dc.date.accessioned | 2022-05-21T02:19:27Z | |
dc.date.available | 2022-05-21T02:19:27Z | |
dc.date.issued | 2022-JUN | |
dc.identifier.other | WOS:000793291500004 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39862 | |
dc.source | WOS | |
dc.title | Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards | |
dc.type | Journal article | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.identifier.doi | 10.1016/j.mtcomm.2022.103482 | |
dc.source.numberofpages | 11 | |
dc.source.peerreview | yes | |
dc.source.journal | MATERIALS TODAY COMMUNICATIONS | |
dc.source.volume | 31 | |
imec.availability | Under review |
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