Browsing Conference contributions by imec author "d79e52f58b3c62ee60f469c8671842672646ff21"

Now showing items 1-2 of 2

Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

Kasai, Hiroaki; Osaki, Mayuka; Hasumi, Kazuhisa; Mise, Nobuyuki; Tanaka, Maki; Tunca Altintas, Bensu; Chew, Soon Aik; Bogdanowicz, Janusz; Moussa, Alain; Saib, Mohamed; Zhang, Boyao; Charley, Anne-Laure (2024)
New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding

De Messemaeker, Joke; Witters, Liesbeth; Zhang, Boyao; Tsau, Thomas; Fodor, Ferenc; De Vos, Joeri; Beyer, Gerald; Croes, Kristof; Beyne, Eric (2023)