Recently added

A BISTABLE SILICON PHOTONIC MEMS PHASE SWITCH FOR NONVOLATILE PHOTONIC CIRCUITS

Edinger, Pierre; Takabayashi, Alain Yuji; Errando-Herranz, Carlos; Khan, Umar; Antony, Cleitus; Talli, Giuseppe; Verheyen, Peter; Bogaerts, Wim; Quack, Niels; Gylfason, Kristinn B. (2022)

IP Session on Chiplet: Design, Assembly, and Test

Vinnakota, Bapi; Derakhshandeh, Jaber; Beyne, Eric; Marinissen, Erik Jan; Chakravarty, Sreejit (2023)

Modeling and spectroscopy of ovonic threshold switching defects

Degraeve, Robin; Ravsher, Taras; Kabuyanagi, Shoichi; Fantini, Andrea; Clima, Sergiu; Garbin, Daniele; Kar, Gouri Sankar (2021)

Impact of Sub-mu m Wafer Thinning on Latch-up Risk in STCO Scaling Era

Serbulova, Kateryna; Chen, Shih-Hung; Hellings, Geert; Hiblot, Gaspard; Veloso, Anabela; Jourdain, Anne; De Boeck, Jo; Groeseneken, Guido; Horiguchi, Naoto (2021)

Gallium phosphide transfer printing for integrated nonlinear photonics

Billet, Maximilien; Poulvellarie, Nicolas; Op de Beeck, Camiel; Reis, Luis; Leger, Yoan; Cornet, Charles; Raineri, Fabrice; Sagnes, Isabelle; Pantzas, Konstantinos; Beaudoin, Gregoire; Roelkens, Gunther; Leo, Francois; Kuyken, Bart (2021)

Experimental Demonstration of Nonlinear fibre Distortion Compensation with Integrated Photonic Reservoir Computing

Sackesyn, Stijn; Ma, Chonghuai; Dambre, Joni; Bienstman, Peter (2021)

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021)

Acoustic modulation during laser debonding of collective hybrid bonded dies

Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bumueller, Dennis; Suhard, Samuel; Bex, Pieter; Tussing, Sebastian; Liu, Xiao; Beyer, Gerald; Beyne, Eric (2021)

200 V GaN-on-SOI Smart Power Platform for Monolithic GaN Power ICs

Cosnier, Thibault; Syshchyk, Olga; De Jaeger, Brice; Geens, Karen; Cingu, Deepthi; Fabris, Elena; Borga, Matteo; Vohra, Anurag; Zhao, Ming; Bakeroot, Benoit; Wellekens, Dirk; Magnani, Alessandro; Vudumula, Pavan; Chatterjee, Urmimala; Langer, Robert; Decoutere, Stefaan (2021)

Analysis of the phase-locking dynamics of a III-V-on-silicon frequency comb laser

Verschelde, Alexis; Van Gasse, Kasper; Kuyken, Bart; Giudici, Massimo; Huyet, Guillaume; Marconi, Mathias (2021)

Configurable Phase/Amplitude Modulator Circuit based on Silicon Plasma Dispersion

Deng, Hong; Bogaerts, Wim (2021)

Contact Interface Characterization of Graphene contacted MoS2 FETs

Koladi Mootheri, Vivek; Minj, Albert; Arutchelvan, Goutham; Leonhardt, Alessandra; Asselberghs, Inge; Heyns, Marc; Radu, Iuliana; Lin, Dennis (2021)

Controlled ALE-type recess of molybdenum for future logic and memory applications

Pacco, Antoine; Nakano, Teppei; Iwasaki, Akihisa; Iwahata, Shota; Altamirano Sanchez, Efrain (2021)

Enhanced data integrity of In-Ga-Zn-Oxide based Capacitor-less 2T memory for DRAM applications

Oh, Hyungrock; Belmonte, Attilio; Perumkunnil, Manu; Mitard, Jerome; Rassoul, Nouredine; Donadio, Gabriele Luca; Delhougne, Romain; Furnemont, Arnaud; Kar, Gouri Sankar; Dehaene, Wim (2021)

Extreme scaling enabled by MX2 transistors: variability challenges (invited)

Smets, Quentin; Arutchelvan, Goutham; Schram, Tom; Verreck, Devin; Groven, Benjamin; Cott, Daire; Ahmed, Zubair; Shi, Yuanyuan; Sutar, Surajit; Nalin Mehta, Ankit; Lin, Dennis; Asselberghs, Inge; Radu, Iuliana (2021)

Noise tolerant ternary weight deep neural networks for analog in-memory inference

Doevenspeck, Jonas; Vrancx, Peter; Laubeuf, Nathan; Mallik, Arindam; Debacker, Peter; Verkest, Diederik; Lauwereins, Rudy; Dehaene, Wim (2021)

JPEG Fake Media: a Provenance-based Sustainable Approach to Secure and Trustworthy Media Annotation

Temmermans, Frederik; Bhowmik, Deepayan; Pereira, Fernando; Ebrahimi, Touradj (2021)

Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations

Tierno, Davide; Ciofi, Ivan; Parvais, Bertrand; Croes, Kristof; Varela Pedreira, Olalla (2023)

Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages

Chuang, Po-Yao; Lorenzelli, Francesco; Chakravarty, Sreejit; Wu, Cheng-Wen; Gielen, Georges; Marinissen, Erik Jan (2023)

Acousto-optic modulation in a Si-waveguide

Ansari, Irfan; Van Thourhout, Dries; George, John P.; Feutmba, Gilles F.; Beeckman, Jeroen (2021)

Conference contributions: Recent submissions

A BISTABLE SILICON PHOTONIC MEMS PHASE SWITCH FOR NONVOLATILE PHOTONIC CIRCUITS ﻿

IP Session on Chiplet: Design, Assembly, and Test ﻿

Modeling and spectroscopy of ovonic threshold switching defects ﻿

Impact of Sub-mu m Wafer Thinning on Latch-up Risk in STCO Scaling Era ﻿

Gallium phosphide transfer printing for integrated nonlinear photonics ﻿

Experimental Demonstration of Nonlinear fibre Distortion Compensation with Integrated Photonic Reservoir Computing ﻿

Demonstration of a collective hybrid die-to-wafer integration using glass carrier ﻿

Acoustic modulation during laser debonding of collective hybrid bonded dies ﻿

200 V GaN-on-SOI Smart Power Platform for Monolithic GaN Power ICs ﻿

Analysis of the phase-locking dynamics of a III-V-on-silicon frequency comb laser ﻿

Configurable Phase/Amplitude Modulator Circuit based on Silicon Plasma Dispersion ﻿

Contact Interface Characterization of Graphene contacted MoS2 FETs ﻿

Controlled ALE-type recess of molybdenum for future logic and memory applications ﻿

Enhanced data integrity of In-Ga-Zn-Oxide based Capacitor-less 2T memory for DRAM applications ﻿

Extreme scaling enabled by MX2 transistors: variability challenges (invited) ﻿

Noise tolerant ternary weight deep neural networks for analog in-memory inference ﻿

JPEG Fake Media: a Provenance-based Sustainable Approach to Secure and Trustworthy Media Annotation ﻿

Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations ﻿

Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages ﻿

Acousto-optic modulation in a Si-waveguide ﻿