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3D SoC integration, beyond 2.5D chiplets
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Milojevic, Dragomir | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2022-07-09T02:27:21Z | |
dc.date.available | 2022-07-09T02:27:21Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 2380-9248 | |
dc.identifier.other | WOS:000812325400116 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40074 | |
dc.source | WOS | |
dc.title | 3D SoC integration, beyond 2.5D chiplets | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Milojevic, Dragomir | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.identifier.doi | 10.1109/IEDM19574.2021.9720614 | |
dc.identifier.eisbn | 978-1-6654-2572-8 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Electron Devices Meeting (IEDM) | |
dc.source.conferencedate | DEC 11-16, 2021 | |
dc.source.conferencelocation | San Francisco | |
imec.availability | Under review |
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