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Low-temperature atomic and molecular hydrogen anneals for enhanced chemical SiO2 IL quality in low thermal budget RMG stacks
dc.contributor.author | Franco, J. | |
dc.contributor.author | Arimura, H. | |
dc.contributor.author | de Marneffe, J-F | |
dc.contributor.author | Wu, Z. | |
dc.contributor.author | Vandooren, A. | |
dc.contributor.author | Ragnarsson, L-A | |
dc.contributor.author | Litta, E. Dentoni | |
dc.contributor.author | Horiguchi, N. | |
dc.contributor.author | Croes, K. | |
dc.contributor.author | Linten, D. | |
dc.contributor.author | Afanas'ev, V | |
dc.contributor.author | Grasser, T. | |
dc.contributor.author | Kaczer, B. | |
dc.date.accessioned | 2022-07-09T02:27:25Z | |
dc.date.available | 2022-07-09T02:27:25Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 2380-9248 | |
dc.identifier.other | WOS:000812325400158 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40082 | |
dc.source | WOS | |
dc.title | Low-temperature atomic and molecular hydrogen anneals for enhanced chemical SiO2 IL quality in low thermal budget RMG stacks | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Franco, J. | |
dc.contributor.imecauthor | Arimura, H. | |
dc.contributor.imecauthor | de Marneffe, J-F | |
dc.contributor.imecauthor | Wu, Z. | |
dc.contributor.imecauthor | Vandooren, A. | |
dc.contributor.imecauthor | Ragnarsson, L-A | |
dc.contributor.imecauthor | Litta, E. Dentoni | |
dc.contributor.imecauthor | Horiguchi, N. | |
dc.contributor.imecauthor | Croes, K. | |
dc.contributor.imecauthor | Linten, D. | |
dc.contributor.imecauthor | Afanas'ev, V | |
dc.contributor.imecauthor | Grasser, T. | |
dc.contributor.imecauthor | Kaczer, B. | |
dc.identifier.doi | 10.1109/IEDM19574.2021.9720657 | |
dc.identifier.eisbn | 978-1-6654-2572-8 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Electron Devices Meeting (IEDM) | |
dc.source.conferencedate | DEC 11-16, 2021 | |
dc.source.conferencelocation | San Francisco | |
imec.availability | Under review |
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