dc.contributor.author | Kundu, Shreya | |
dc.contributor.author | Decoster, Stefan | |
dc.contributor.author | Bezard, Philippe | |
dc.contributor.author | Nalin Mehta, Ankit | |
dc.contributor.author | Dekkers, Harold | |
dc.contributor.author | Lazzarino, Frederic | |
dc.date.accessioned | 2022-08-26T09:13:19Z | |
dc.date.available | 2022-08-05T02:35:40Z | |
dc.date.available | 2022-08-19T09:22:58Z | |
dc.date.available | 2022-08-26T09:13:19Z | |
dc.date.issued | 2022-07-19 | |
dc.identifier.issn | 1944-8244 | |
dc.identifier.other | WOS:000831516200001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40204.3 | |
dc.source | WOS | |
dc.title | High-Density Patterning of InGaZnO by CH4: a Comparative Study of RIE and Pulsed Plasma ALE | |
dc.type | Journal article | |
dc.contributor.imecauthor | Kundu, Shreya | |
dc.contributor.imecauthor | Decoster, Stefan | |
dc.contributor.imecauthor | Bezard, Philippe | |
dc.contributor.imecauthor | Nalin Mehta, Ankit | |
dc.contributor.imecauthor | Dekkers, Harold | |
dc.contributor.imecauthor | Lazzarino, Frederic | |
dc.contributor.orcidimec | Kundu, Shreya::0000-0001-8052-7774 | |
dc.contributor.orcidimec | Decoster, Stefan::0000-0003-1162-9288 | |
dc.contributor.orcidimec | Dekkers, Harold::0000-0003-4778-5709 | |
dc.contributor.orcidimec | Lazzarino, Frederic::0000-0001-7961-9727 | |
dc.contributor.orcidimec | Nalin Mehta, Ankit::0000-0002-2169-940X | |
dc.contributor.orcidimec | Bezard, Philippe::0000-0003-2499-0240 | |
dc.date.embargo | 9999-12-31 | |
dc.identifier.doi | 10.1021/acsami.2c07514 | |
dc.source.numberofpages | 11 | |
dc.source.peerreview | yes | |
dc.subject.discipline | Materials science | |
dc.source.beginpage | 34029 | |
dc.source.endpage | 34039 | |
dc.source.journal | ACS APPLIED MATERIALS & INTERFACES | |
dc.identifier.pmid | MEDLINE:35850517 | |
dc.source.issue | 29 | |
dc.source.volume | 14 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | The authors would like to thank Nouredine Rassoul (IMEC) for discussion on the HM strategy and Subhali Subhechha (IMEC) for providing a brief overview of the intended applications of IGZO. We acknowledge the support of IMECs Industrial Affiliation Program and the Active Memory Program. We also acknowledge the support of IMECs pilot line and SEM and MCA team for help with deposition and characterization processes. | |