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Flip-chip-integrated silicon nitride ECL at 640nm with relaxed alignment tolerances

dc.contributor.authorKluge, Ines
dc.contributor.authorSchulten, Michael
dc.contributor.authorMashayekh, Alireza Tabatabaei
dc.contributor.authorRodrigo, Rebecca
dc.contributor.authorAckermann, Manuel
dc.contributor.authorGhannam, Ibrahim
dc.contributor.authorStassen, Andim
dc.contributor.authorMerget, Florian
dc.contributor.authorLeisching, Patrick
dc.contributor.authorWitzens, Jeremy
dc.date.accessioned2023-06-16T09:47:39Z
dc.date.available2022-08-14T02:35:24Z
dc.date.available2023-06-16T09:47:39Z
dc.date.issued2022
dc.identifier.isbn978-1-5106-4883-8
dc.identifier.issn0277-786X
dc.identifier.otherWOS:000831668100013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40260.2
dc.sourceWOS
dc.titleFlip-chip-integrated silicon nitride ECL at 640nm with relaxed alignment tolerances
dc.typeProceedings paper
dc.contributor.imecauthorStassen, Andim
dc.contributor.orcidimecStassen, Andim::0000-0001-8819-9592
dc.identifier.doi10.1117/12.2607615
dc.identifier.eisbn978-1-5106-4884-5
dc.source.numberofpages9
dc.source.peerreviewyes
dc.source.beginpage120060E
dc.source.conferenceConference on Silicon Photonics XVII Part of SPIE Photonics West OPTO Conference
dc.source.conferencedateJAN 22-FEB 24, 2022
dc.source.conferencelocationSan Francisco
dc.source.journalProceedings of SPIE
dc.source.volume12006
imec.availabilityPublished - imec
dc.description.wosFundingTextThe authors would like to acknowledge funding from the European Union under project PIX4life (688519) and from the German Federal Ministry of Education and Research for project HiPEQ (13N15965).


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220.500.12860/40260.2*2023-06-16T09:40:45Zvalidation by library/open access desk
120.500.12860/402602022-08-14T02:35:24Z

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