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dc.contributor.authorDas, Sayantan
dc.contributor.authorSah, Kaushik
dc.contributor.authorFallica, Roberto
dc.contributor.authorChen, Zhijin
dc.contributor.authorHalder, Sandip
dc.contributor.authorCross, Andrew
dc.contributor.authorDe Simone, Danilo
dc.contributor.authorTreska, Fergo
dc.contributor.authorLeray, Philippe
dc.contributor.authorKim, Ryan Ryoung han
dc.contributor.authorMaguire, Ethan
dc.contributor.authorWei, Chih-, I
dc.contributor.authorFenger, Germain
dc.contributor.authorLafferty, Neal
dc.contributor.authorLee, Jeonghoon
dc.date.accessioned2023-06-20T11:46:58Z
dc.date.available2022-09-08T02:38:56Z
dc.date.available2023-06-20T11:46:58Z
dc.date.issued2022
dc.identifier.isbn978-1-5106-4985-9
dc.identifier.issn0277-786X
dc.identifier.otherWOS:000844546500002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40373.2
dc.sourceWOS
dc.titleEUV based multi-patterning schemes for advanced DRAM nodes
dc.typeProceedings paper
dc.contributor.imecauthorDas, Sayantan
dc.contributor.imecauthorFallica, Roberto
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorDe Simone, Danilo
dc.contributor.imecauthorTreska, Fergo
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorKim, Ryan Ryoung han
dc.contributor.imecauthorLee, Jeonghoon
dc.contributor.orcidimecDas, Sayantan::0000-0002-3031-0726
dc.contributor.orcidimecFallica, Roberto::0000-0003-4523-9624
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDe Simone, Danilo::0000-0003-3927-5207
dc.contributor.orcidimecTreska, Fergo::0000-0002-0171-5847
dc.contributor.orcidimecLeray, Philippe::0000-0002-1086-270X
dc.identifier.doi10.1117/12.2615644
dc.identifier.eisbn978-1-5106-4986-6
dc.source.numberofpages10
dc.source.peerreviewyes
dc.source.beginpageArt. 1205503
dc.source.conferenceConference on Advances in Patterning Materials and Processes XXXIX Part of SPIE Advanced Lithography and Patterning Conference
dc.source.conferencedateAPR 24-MAY 27, 2022
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.volume12055
imec.availabilityPublished - imec


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