dc.contributor.author | Coenen, David | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | De Heyn, Peter | |
dc.contributor.author | Van Campenhout, Joris | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2023-01-04T10:28:32Z | |
dc.date.available | 2022-09-08T02:39:36Z | |
dc.date.available | 2022-09-19T11:10:15Z | |
dc.date.available | 2023-01-04T10:28:32Z | |
dc.date.issued | 2022-08-03 | |
dc.identifier.issn | 2156-3950 | |
dc.identifier.other | WOS:000845064700016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40395.3 | |
dc.source | WOS | |
dc.title | Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models | |
dc.type | Journal article | |
dc.contributor.imecauthor | Coenen, David | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | De Heyn, Peter | |
dc.contributor.imecauthor | Van Campenhout, Joris | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Coenen, David::0000-0002-3732-1874 | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | De Heyn, Peter::0000-0003-3523-7377 | |
dc.contributor.orcidimec | Van Campenhout, Joris::0000-0003-0778-2669 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.date.embargo | 2022-08-31 | |
dc.identifier.doi | 10.1109/TCPMT.2022.3195699 | |
dc.source.numberofpages | 8 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1350 | |
dc.source.endpage | 1357 | |
dc.source.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | |
dc.source.issue | 8 | |
dc.source.volume | 12 | |
imec.availability | Published - open access | |