Publication:

Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models

Date

2022-08-03
Journal article
https://doi.org/10.1109/TCPMT.2022.3195699
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Accepted version 2.38 MB

Author(s)

Coenen, David  
;
Oprins, Herman  
;
De Heyn, Peter  
;
Van Campenhout, Joris  
;
De Wolf, Ingrid  

Journal

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

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1530 since deposited on 2022-09-08
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1451 since deposited on 2022-09-08
Acq. date: 2026-03-01

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