Publication:

Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models

Date

2022-08-03
Journal article
https://doi.org/10.1109/TCPMT.2022.3195699
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dc.contributor.authorCoenen, David
dc.contributor.authorOprins, Herman
dc.contributor.authorDe Heyn, Peter
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorCoenen, David
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorDe Heyn, Peter
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCoenen, David::0000-0002-3732-1874
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDe Heyn, Peter::0000-0003-3523-7377
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2023-01-04T10:28:32Z
dc.date.available2022-09-08T02:39:36Z
dc.date.available2022-09-19T11:10:15Z
dc.date.available2023-01-04T10:28:32Z
dc.date.embargo2022-08-31
dc.date.issued2022-08-03
dc.identifier.doi10.1109/TCPMT.2022.3195699
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40395
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1350
dc.source.endpage1357
dc.source.issue8
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages8
dc.source.volume12
dc.title

Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models

dc.typeJournal article
dspace.entity.typePublication
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