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Direct Bonding Using Low Temperature SiCN Dielectrics

dc.contributor.authorIacovo, Serena
dc.contributor.authorNagano, Fuya
dc.contributor.authorChannam, Venkat Sunil Kumar
dc.contributor.authorWalsby, Edward
dc.contributor.authorCrook, Kath
dc.contributor.authorBuchanan, Keith
dc.contributor.authorJourdain, Anne
dc.contributor.authorVanstreels, Kris
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-04-28T10:17:08Z
dc.date.available2022-09-17T02:52:07Z
dc.date.available2023-04-28T10:17:08Z
dc.date.issued2022
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000848765300095
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40441.2
dc.sourceWOS
dc.titleDirect Bonding Using Low Temperature SiCN Dielectrics
dc.typeProceedings paper
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorChannam, Venkat Sunil Kumar
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecNagano, Fuya::0000-0001-5315-8694
dc.contributor.orcidimecChannam, Venkat Sunil Kumar::0000-0003-2034-4313
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC51906.2022.00101
dc.identifier.eisbn978-1-6654-7943-1
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage602
dc.source.endpage607
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/40441.2*2023-04-28T10:16:09Zvalidation by library/open access desk
120.500.12860/404412022-09-17T02:52:07Z

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