dc.contributor.author | Zhang, Jing | |
dc.contributor.author | Kruckel, Clemens | |
dc.contributor.author | Haq, Bahawal | |
dc.contributor.author | Matuskova, Bozena | |
dc.contributor.author | Rimbock, Johanna | |
dc.contributor.author | Ertl, Stefan | |
dc.contributor.author | Gocalinska, Agnieszka | |
dc.contributor.author | Pelucchi, Emanuele | |
dc.contributor.author | Corbett, Brian | |
dc.contributor.author | Van Campenhout, Joris | |
dc.contributor.author | Lepage, Guy | |
dc.contributor.author | Verheyen, Peter | |
dc.contributor.author | Van Thourhout, Dries | |
dc.contributor.author | Baets, Roel | |
dc.contributor.author | Roelkens, Gunther | |
dc.date.accessioned | 2022-12-19T10:21:36Z | |
dc.date.available | 2022-09-17T02:52:09Z | |
dc.date.available | 2022-12-19T10:21:36Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000848765300071 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40444.2 | |
dc.source | WOS | |
dc.title | Lossless High-speed Silicon Photonic MZI switch with a Micro-Transfer-Printed III-V amplifier | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Zhang, Jing | |
dc.contributor.imecauthor | Kruckel, Clemens | |
dc.contributor.imecauthor | Haq, Bahawal | |
dc.contributor.imecauthor | Van Campenhout, Joris | |
dc.contributor.imecauthor | Lepage, Guy | |
dc.contributor.imecauthor | Verheyen, Peter | |
dc.contributor.imecauthor | Van Thourhout, Dries | |
dc.contributor.imecauthor | Baets, Roel | |
dc.contributor.imecauthor | Roelkens, Gunther | |
dc.contributor.orcidimec | Zhang, Jing::0000-0001-6608-9990 | |
dc.contributor.orcidimec | Van Campenhout, Joris::0000-0003-0778-2669 | |
dc.contributor.orcidimec | Verheyen, Peter::0000-0002-8245-9442 | |
dc.contributor.orcidimec | Van Thourhout, Dries::0000-0003-0111-431X | |
dc.contributor.orcidimec | Baets, Roel::0000-0003-1266-1319 | |
dc.contributor.orcidimec | Roelkens, Gunther::0000-0002-4667-5092 | |
dc.contributor.orcidimec | Kruckel, Clemens::0000-0002-5469-9211 | |
dc.contributor.orcidimec | Lepage, Guy::0000-0002-3883-4452 | |
dc.identifier.doi | 10.1109/ECTC51906.2022.00077 | |
dc.identifier.eisbn | 978-1-6654-7943-1 | |
dc.source.numberofpages | 5 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 441 | |
dc.source.endpage | 445 | |
dc.source.conference | 72nd IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 31-JUN 01, 2022 | |
dc.source.conferencelocation | San Diego | |
dc.source.journal | na | |
imec.availability | Published - imec | |
dc.description.wosFundingText | This work was supported by the European Union grant 825453 (CALADAN), 814276 (ITN WON), INTERREGFWVL SafeSide and 713481 (SPICE). | |