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Confined IMCs for low temperature and high throughput D2W bonding

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGerets, Carine
dc.contributor.authorCochet, Tom
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorDe Preter, Inge
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorWebers, Tomas
dc.contributor.authorBeyne, Eric
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.date.accessioned2023-02-23T12:32:02Z
dc.date.available2022-09-22T02:50:27Z
dc.date.available2023-02-23T12:32:02Z
dc.date.issued2022
dc.identifier.issnna
dc.identifier.otherWOS:000851392600066
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40473.3
dc.sourceWOS
dc.titleConfined IMCs for low temperature and high throughput D2W bonding
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorLa Tulipe, Douglas Charles
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecShafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecGerets, Carine::0009-0007-2069-6032
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.identifier.eisbn978-4-9911911-3-8
dc.source.numberofpages2
dc.source.peerreviewyes
dc.source.beginpage131
dc.source.endpage132
dc.source.conferenceInternational Conference on Electronics Packaging (ICEP)
dc.source.conferencedateMAY 11-14, 2022
dc.source.conferencelocationSapporo
dc.source.journalna
imec.availabilityPublished - imec
dc.description.wosFundingTextAuthors would like to acknowledge IMEC p-line for their support of processing and bonding tests.


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320.500.12860/40473.3*2023-02-23T12:31:15Zvalidation by library/open access desk
120.500.12860/404732022-09-22T02:50:27Z

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