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The unique properties of SiCN as bonding material for hybrid bonding

dc.contributor.authorIacovo, Serena
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorNagano, Fuya
dc.contributor.authorPeng, Lan
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-01-20T09:34:02Z
dc.date.available2022-09-24T02:50:52Z
dc.date.available2023-01-20T09:34:02Z
dc.date.issued2021
dc.identifier.issnna
dc.identifier.otherWOS:000853032600038
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40495.3
dc.sourceWOS
dc.titleThe unique properties of SiCN as bonding material for hybrid bonding
dc.typeProceedings paper
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecNagano, Fuya::0000-0001-5315-8694
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/LTB-3D53950.2021.9598192
dc.identifier.eisbn978-1-6654-0567-6
dc.source.numberofpages1
dc.source.peerreviewyes
dc.source.beginpage38
dc.source.endpage38
dc.source.conference7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
dc.source.conferencedateOCT 05-11, 2021
dc.source.conferencelocationNara, Japan
dc.source.journalna
imec.availabilityPublished - imec


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320.500.12860/40495.3*2023-01-20T09:23:25Zvalidation by library/open access desk
120.500.12860/404952022-09-24T02:50:52Z

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