The unique properties of SiCN as bonding material for hybrid bonding

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dc.contributor.author	Iacovo, Serena
dc.contributor.author	Kim, Soon-Wook
dc.contributor.author	Nagano, Fuya
dc.contributor.author	Peng, Lan
dc.contributor.author	Inoue, Fumihiro
dc.contributor.author	Phommahaxay, Alain
dc.contributor.author	Beync, Eric
dc.date.accessioned	2022-09-24T02:50:52Z
dc.date.available	2022-09-24T02:50:52Z
dc.date.issued	2021
dc.identifier.other	WOS:000853032600038
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40495
dc.source	WOS
dc.title	The unique properties of SiCN as bonding material for hybrid bonding
dc.type	Proceedings paper
dc.contributor.imecauthor	Iacovo, Serena
dc.contributor.imecauthor	Kim, Soon-Wook
dc.contributor.imecauthor	Nagano, Fuya
dc.contributor.imecauthor	Peng, Lan
dc.contributor.imecauthor	Inoue, Fumihiro
dc.contributor.imecauthor	Phommahaxay, Alain
dc.contributor.imecauthor	Beync, Eric
dc.contributor.orcidimec	Iacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimec	Nagano, Fuya::0000-0001-5315-8694
dc.contributor.orcidimec	Peng, Lan::0000-0003-1824-126X
dc.contributor.orcidimec	Phommahaxay, Alain::0000-0001-8672-2386
dc.identifier.doi	10.1109/LTB-3D53950.2021.9598192
dc.identifier.eisbn	978-1-6654-0567-6
dc.source.numberofpages	1
dc.source.peerreview	yes
dc.source.beginpage	38
dc.source.endpage	38
dc.source.conference	7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
dc.source.conferencedate	OCT 05-11, 2021
imec.availability	Under review

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Version	Item	Date	Summary
3	20.500.12860/40495.3	2023-01-20T09:23:25Z	validation by library/open access desk
1	20.500.12860/40495*	2022-09-24T02:50:52Z