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A new approach of flip chip on board technology using SMT compatible processes

dc.contributor.authorZhang, S.
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-14T12:00:19Z
dc.date.available2021-10-14T12:00:19Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4050
dc.sourceIIOimport
dc.titleA new approach of flip chip on board technology using SMT compatible processes
dc.typeProceedings paper
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage111
dc.source.endpage117
dc.source.conferenceProceedings of the 12th European Microelectronics and Packaging Conference
dc.source.conferencedate7/06/1999
dc.source.conferencelocationHarrogate UK
imec.availabilityPublished - open access


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