Show simple item record

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism

dc.contributor.authorHou, Lin
dc.contributor.authorChery, Emmanuel
dc.contributor.authorCroes, Kristof
dc.contributor.authorTierno, Davide
dc.contributor.authorChew, Soon Aik
dc.contributor.authorChen, Yangyin
dc.contributor.authorRakbin, Peter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-06-08T13:08:28Z
dc.date.available2022-11-15T11:38:58Z
dc.date.available2023-06-08T13:08:28Z
dc.date.issued2022-03
dc.identifier.issn1938-1891
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40739.2
dc.titleReliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
dc.typeProceedings paper
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTierno, Davide
dc.contributor.imecauthorChew, Soon Aik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecTierno, Davide::0000-0003-4915-904X
dc.contributor.orcidimecChew, Soon Aik::0000-0003-3013-4846
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo2022-03-31
dc.source.numberofpages6
dc.source.peerreviewno
dc.subject.disciplineMaterials science
dc.source.conferenceInternational Reliability Symposium
dc.source.conferencedate27-31 March 2022
dc.source.conferencelocationDallas, TX, USA
dc.source.journalIEEE
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
Reliability Investigation of W2W ...
Size:
4.078Mb
Format:
PDF
Description:
Accepted version
View/open

This item appears in the following collection(s)

Show simple item record

Version history

VersionItemDateSummary
220.500.12860/40739.2*2023-06-08T13:07:22Zvalidation by library/open access desk
120.500.12860/407392022-11-15T11:38:58Z

*Selected version