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Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
Publication:
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
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Date
2022
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hou, Lin
;
Chery, Emmanuel
;
Croes, Kristof
;
Tierno, Davide
;
Chew, Soon Aik
;
Chen, Yangyin
;
Rakbin, Peter
;
Beyne, Eric
Journal
IEEE
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1331
since deposited on 2022-11-15
Acq. date: 2026-08-09
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Statistics
Downloads
1088
since deposited on 2022-11-15
173
last month
45
last week
Acq. date: 2026-08-09
Views
1331
since deposited on 2022-11-15
Acq. date: 2026-08-09
Citations