Publication:

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism

Date

2022-03
Proceedings Paper
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dc.contributor.authorHou, Lin
dc.contributor.authorChery, Emmanuel
dc.contributor.authorCroes, Kristof
dc.contributor.authorTierno, Davide
dc.contributor.authorChew, Soon Aik
dc.contributor.authorChen, Yangyin
dc.contributor.authorRakbin, Peter
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTierno, Davide
dc.contributor.imecauthorChew, Soon Aik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecTierno, Davide::0000-0003-4915-904X
dc.contributor.orcidimecChew, Soon Aik::0000-0003-3013-4846
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-06-08T13:08:28Z
dc.date.available2022-11-15T11:38:58Z
dc.date.available2023-06-08T13:08:28Z
dc.date.embargo2022-03-31
dc.date.issued2022-03
dc.identifier.issn1938-1891
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40739
dc.publisherIEEE
dc.source.conferenceInternational Reliability Symposium
dc.source.conferencedate27-31 March 2022
dc.source.conferencelocationDallas, TX, USA
dc.source.journalIEEE
dc.source.numberofpages6
dc.subject.disciplineMaterials science
dc.subject.keywordsWafer-To-Wafer (W2W) bonding
dc.subject.keywordsreliability
dc.subject.keywordsdielectric breakdown
dc.subject.keywordshybrid pad leakage
dc.title

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism

dc.typeProceedings paper
dspace.entity.typePublication
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