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Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
Publication:
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
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Date
2022-03
Proceedings Paper
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4.08 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hou, Lin
;
Chery, Emmanuel
;
Croes, Kristof
;
Tierno, Davide
;
Chew, Soon Aik
;
Chen, Yangyin
;
Rakbin, Peter
;
Beyne, Eric
Journal
IEEE
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416
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Acq. date: 2025-12-15
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1314
since deposited on 2022-11-15
2
last month
Acq. date: 2025-12-15
Citations
Metrics
Downloads
416
since deposited on 2022-11-15
89
last month
15
last week
Acq. date: 2025-12-15
Views
1314
since deposited on 2022-11-15
2
last month
Acq. date: 2025-12-15
Citations