Towards Sustainable Wet Processing for Advanced Integration Technologies

Abstract

The new challenges for wet processing are associated with the new materials and the scaling roadmap for Logic, Memory, and 3D system integration (STCO) i.e CFET, 3D Memory, D2W, W2W, and FOWLP. The specifications for defects, pattern-collapse, selectivity, and uniformity will be tighter and tighter, demanding more advanced hardware and formulated chemicals. One challenge for the cleaning community will be how to contribute to maximizing the wet processing performance and the cost-benefit. In the Semiconductor industry, wet processes are more and more critical but also resources intensive in energy, water, and chemicals. Hence, another big challenge ahead for the cleaning community is how to minimize GHG emissions and abide by the announced targets for net-zero carbon emissions by 2050. In this paper, examples of the above-mentioned technologies and the related wet processes will be discussed.