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Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
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Authors
Beerten, Steven
;
Labie, Riet
;
Beyne, Eric
;
Van Hoof, Rita
;
Honoré, Mia
Conference
IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings
Title
Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
Publication type
Proceedings paper
Embargo date
9999-12-31
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