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Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
Publication:
Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
Date
2000
Proceedings Paper
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4075.pdf
372.94 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beerten, Steven
;
Labie, Riet
;
Beyne, Eric
;
Van Hoof, Rita
;
Honoré, Mia
Journal
Abstract
Description
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2011
since deposited on 2021-10-14
425
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
2011
since deposited on 2021-10-14
425
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations