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dc.contributor.authorChen, Cheng
dc.contributor.authorPourkazemi, Ali
dc.contributor.authorZhao, Wu
dc.contributor.authorVan den Brande, Niko
dc.contributor.authorHauffman, Tom
dc.contributor.authorZhang, Zhiyong
dc.contributor.authorStiens, Johan
dc.date.accessioned2023-07-05T15:17:27Z
dc.date.available2023-02-28T03:29:47Z
dc.date.available2023-07-05T15:17:27Z
dc.date.issued2023
dc.identifier.issn0169-4332
dc.identifier.otherWOS:000926833100001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41201.2
dc.sourceWOS
dc.titleA new exploration of quality testing technique for the wafer-scale graphene film based on the terahertz vector network analysis technology
dc.typeJournal article
dc.contributor.imecauthorStiens, Johan
dc.contributor.orcidimecStiens, Johan::0000-0001-5049-7885
dc.identifier.doi10.1016/j.apsusc.2023.156498
dc.source.numberofpages13
dc.source.peerreviewyes
dc.source.beginpageArt. 156498
dc.source.endpagena
dc.source.journalAPPLIED SURFACE SCIENCE
dc.source.issueApril
dc.source.volume616
imec.availabilityPublished - imec
dc.description.wosFundingTextThe authors declare the following financial interests/personal re- lationships which may be considered as potential competing interests: Johan Stiens reports financial support was provided by Research Foundation Flanders. Cheng Chen reports financial support was pro- vided by Research Foundation Flanders. Cheng Chen reports financial support was provided by China Scholarship Council. The authors of Vrije Universiteit Brussel (VUB) and Interuniversity Microelectronic Center (IMEC) acknowledge the funding by the SRP- project M3D2; the ETRO-IOF242 project; acknowledge the OZR-3251 project ("GHz-THz VNA measurement infrastructure: from benchtop to portable instruments ") , which provides a strong economic guarantee for the establishment of the THz-VNA platform. The authors of Northwest University (NWU) acknowledge the funding Youth Foundation of Shaanxi Natural Science Foundation (2023-JC-QN-0700) . and thank for the support of Xian New Low-dimensional Materials and Devices and Terahertz Technology International Science and Technology Cooperation Base.


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