| dc.contributor.author | Singh, Nishant | |
| dc.contributor.author | Van Kerrebrouck, Joris | |
| dc.contributor.author | Demeester, Piet | |
| dc.contributor.author | Yin, Xin | |
| dc.contributor.author | Torfs, Guy | |
| dc.date.accessioned | 2023-04-25T09:04:18Z | |
| dc.date.available | 2023-03-26T03:50:02Z | |
| dc.date.available | 2023-04-25T09:04:18Z | |
| dc.date.issued | 2022 | |
| dc.identifier.issn | na | |
| dc.identifier.other | WOS:000925380500350 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41376.2 | |
| dc.source | WOS | |
| dc.title | 60 GHz Analog Radio-over-Fiber Single Sideband Transmitter Chipset with 55nm SiGe BiCMOS Driver RFIC and Silicon Photonics Modulator PIC | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Singh, Nishant | |
| dc.contributor.imecauthor | Van Kerrebrouck, Joris | |
| dc.contributor.imecauthor | Demeester, Piet | |
| dc.contributor.imecauthor | Yin, Xin | |
| dc.contributor.imecauthor | Torfs, Guy | |
| dc.contributor.orcidimec | Singh, Nishant::0000-0003-0609-1145 | |
| dc.contributor.orcidimec | Van Kerrebrouck, Joris::0000-0002-6611-7979 | |
| dc.contributor.orcidimec | Demeester, Piet::0000-0003-2810-3899 | |
| dc.contributor.orcidimec | Yin, Xin::0000-0002-9672-6652 | |
| dc.contributor.orcidimec | Torfs, Guy::0000-0003-1817-5370 | |
| dc.date.embargo | 2022-09-22 | |
| dc.identifier.eisbn | 978-1-957171-15-9 | |
| dc.source.numberofpages | 4 | |
| dc.source.peerreview | yes | |
| dc.source.conference | European Conference on Optical Communication (ECOC) | |
| dc.source.conferencedate | SEP 18-22, 2022 | |
| dc.source.conferencelocation | Basel | |
| dc.source.journal | na | |
| imec.availability | Published - open access | |
| dc.description.wosFundingText | This work was supported in part by the ERC Advanced Grant ATTO Project under Grant 695495, in part by H2020 5G-PHOS Project under Grant 761989 and in part by the Methusalem Grant SHAPE ("Next Generation Wireless Networks"). The authors would like to thank Jean-Francois Paillotin at CMP for assistance during tapeout, Thomas Vervust at NaMiFab for dicing and thinning, Michal Szaj at Argotech for the wirebonding service and Laurens Breyne for the PCB. | |
