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A grain size limitation inherent to electroplated copper films

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T12:42:24Z
dc.date.available2021-10-14T12:42:24Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4157
dc.sourceIIOimport
dc.titleA grain size limitation inherent to electroplated copper films
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage31
dc.source.endpage33
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate5/06/2000
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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