Exchanging Thermo-Mechanical Simulation Models independent on FEM Software Platform

Abstract

Exchanging thermo-mechanical simulation models between institutes and companies are useful in research and development projects, in general for electronic components and systems. As different software codes are used at different R&D sites, models need to be shared in a consistent way, with the objective to get the same results independent on the code. This involves in first instance correct transfer of dimensions, boundary conditions and material properties. In this research work, the exchange between different software is applied for two different models. A first model focuses on a combined displacement and temperature cycling load on a single bump, the second model is a full flip chip BGA package soldered to a board.

The first model was a learning exercise on how to exchange models. After some iterations, a rather good agreement was achieved. The final benchmarking exercise was done on the full BGA assembly. It was found that there are still variations of about 30% between the different software codes, even after several fine tunings.

The outcome of this work could be an initiation for a kind of standard or general guideline on how exchange models.