dc.contributor.author | Sepulveda Marquez, Alfonso | |
dc.contributor.author | Hellin, David | |
dc.contributor.author | Zhang, Liping | |
dc.contributor.author | Kenis, Karine | |
dc.contributor.author | Batuk, Dmitry | |
dc.contributor.author | Baudot, Sylvain | |
dc.contributor.author | Briggs, Basoene | |
dc.contributor.author | Mountsier, Tom | |
dc.contributor.author | Barla, Kathy | |
dc.contributor.author | Morin, Pierre | |
dc.contributor.author | Altamirano Sanchez, Efrain | |
dc.date.accessioned | 2023-06-20T13:57:09Z | |
dc.date.available | 2023-06-20T10:34:30Z | |
dc.date.available | 2023-06-20T13:57:09Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 1369-8001 | |
dc.identifier.other | WOS:000788064600005 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41852.2 | |
dc.source | WOS | |
dc.title | New bending mode in SAQP Si fins and its mitigation | |
dc.type | Journal article | |
dc.contributor.imecauthor | Sepulveda Marquez, Alfonso | |
dc.contributor.imecauthor | Zhang, Liping | |
dc.contributor.imecauthor | Kenis, Karine | |
dc.contributor.imecauthor | Batuk, Dmitry | |
dc.contributor.imecauthor | Baudot, Sylvain | |
dc.contributor.imecauthor | Briggs, Basoene | |
dc.contributor.imecauthor | Barla, Kathy | |
dc.contributor.imecauthor | Morin, Pierre | |
dc.contributor.imecauthor | Altamirano Sanchez, Efrain | |
dc.contributor.orcidimec | Zhang, Liping::0000-0002-2947-8660 | |
dc.contributor.orcidimec | Sanchez, Efrain Altamirano::0000-0003-3235-6055 | |
dc.contributor.orcidimec | Batuk, Dmitry::0000-0002-6384-6690 | |
dc.contributor.orcidimec | Morin, Pierre::0000-0002-4637-496X | |
dc.contributor.orcidimec | Sepulveda Marquez, Alfonso::0000-0003-4726-177X | |
dc.contributor.orcidimec | Altamirano Sanchez, Efrain::0000-0003-3235-6055 | |
dc.contributor.orcidimec | Kenis, Karine::0000-0001-7116-7498 | |
dc.identifier.doi | 10.1016/j.mssp.2021.106437 | |
dc.source.numberofpages | 8 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 106437 | |
dc.source.endpage | na | |
dc.source.journal | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING | |
dc.source.issue | April | |
dc.source.volume | 141 | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The authors would like to acknowledge the Logic Program of imec, the Materials and Components Analysis team (MCA) , the SEM/TEMteam and Arenberg 300 mm pilot line for their support. P.M. is deeply grateful to Dr. Shay Reboh from CEA Leti for former collaboration and discussion on mechanical modelling, applied here to establish equation (5) . | |