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Local stress measurements in packaging by Raman spectroscopy

dc.contributor.authorChen, Jian
dc.contributor.authorChan, M.
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-14T12:43:56Z
dc.date.available2021-10-14T12:43:56Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4189
dc.sourceIIOimport
dc.titleLocal stress measurements in packaging by Raman spectroscopy
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage159
dc.source.endpage162
dc.source.conferenceProceedings of the 3rd Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate5/12/2000
dc.source.conferencelocationSingapore
imec.availabilityPublished - open access


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