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dc.contributor.authorJacobs, Kristof J. P.
dc.contributor.authorStucchi, Michele
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-06-29T11:03:32Z
dc.date.available2023-06-20T10:37:17Z
dc.date.available2023-06-29T11:03:32Z
dc.date.issued2021
dc.identifier.issn0018-9456
dc.identifier.otherWOS:000698641700001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41973.2
dc.sourceWOS
dc.titleLocalization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
dc.typeJournal article
dc.contributor.imecauthorJacobs, Kristof J. P.
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J. P.::0000-0002-1081-3633
dc.contributor.orcidimecStucchi, Michele::0000-0002-7848-0492
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/TIM.2021.3108531
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.journalIEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
dc.source.issue1
dc.source.volume70
imec.availabilityUnder review


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