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Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
dc.contributor.author | Jacobs, Kristof J. P. | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2023-06-29T11:03:32Z | |
dc.date.available | 2023-06-20T10:37:17Z | |
dc.date.available | 2023-06-29T11:03:32Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 0018-9456 | |
dc.identifier.other | WOS:000698641700001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41973.2 | |
dc.source | WOS | |
dc.title | Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy | |
dc.type | Journal article | |
dc.contributor.imecauthor | Jacobs, Kristof J. P. | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Jacobs, Kristof J. P.::0000-0002-1081-3633 | |
dc.contributor.orcidimec | Stucchi, Michele::0000-0002-7848-0492 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/TIM.2021.3108531 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1 | |
dc.source.endpage | 7 | |
dc.source.journal | IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | |
dc.source.issue | 1 | |
dc.source.volume | 70 | |
imec.availability | Under review |
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