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Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
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Authors
Jacobs, Kristof J.P.
;
Stucchi, Michele
;
Beyne, Eric
DOI
10.1109/TIM.2021.3108531
ISSN
0018-9456
Issue
1
Journal
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
Volume
70
Title
Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
Publication type
Journal article
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3
20.500.12860/41973.3
*
2023-08-08T07:49:30Z
validation by library/open access desk
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20.500.12860/41973.2
2023-06-27T07:55:36Z
validation by imec author
1
20.500.12860/41973
2023-06-20T10:37:17Z
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