Browsing by author "Jacobs, Kristof J.P."
Now showing items 1-16 of 16
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Advances in failure analysis techniques for 3D-technology
De Wolf, Ingrid; Jacobs, Kristof J.P. (2017) -
Defect localization in 3-D TSV structures by differential light-induced capacitance alteration
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration
Jacobs, Kristof J.P.; Kim, Soon-Wook; De Wolf, Ingrid; Beyne, Eric (2020) -
Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration
Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid (2016) -
Light-induced capacitance alteration for non-destructive open failure localization in 3-D TSV structures
Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2017) -
Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
Jacobs, Kristof J.P.; Li, Yunlong; Van Huylenbroeck, Stefaan; De Wolf, Ingrid; Beyne, Eric (2019) -
Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
Jacobs, Kristof J.P.; Stucchi, Michele; Beyne, Eric (2021) -
Localizing manufacturing defects in 3-D IC technology by scanning photocapacitance microscopy
Jacobs, Kristof J.P. (2018) -
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices
Jacobs, Kristof J.P.; Wang, Teng; Stucchi, Michele; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2017) -
Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
De Wolf, Ingrid; Jacobs, Kristof J.P.; Orozco, Antonio (2020) -
New technique localizes defects in 3D chips
Jacobs, Kristof J.P.; Parton, Els (2017) -
Open defect localization in 1x5 $lm 3-D TSV structures by Light-Induced Capacitance Alteration (LICA)
Jacobs, Kristof J.P.; De Vos, Joeri; Stucchi, Michele; De Wolf, Ingrid; Beyne, Eric (2018) -
Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects
Jacobs, Kristof J.P.; Li, Yunlong; Stucchi, Michele; De Wolf, Ingrid; Van Huylenbroeck, Stefaan; De Vos, Joeri; Beyne, Eric (2020) -
Reliability of p-GaN Gate HEMTs in Reverse Conduction
Cingu, Deepthi; Li, Xiangdong; Bakeroot, Benoit; Amirifar, Nooshin; Geens, Karen; Jacobs, Kristof J.P.; Zhao, Ming; You, Shuzhen; Groeseneken, Guido; Decoutere, Stefaan (2021) -
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Koegel, Michael; Brand, Sebastian; Grosse, Christian; Jacobs, Kristof J.P.; De Wolf, Ingrid; Altmann, Frank (2021)