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Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations

dc.contributor.authorVandemaele, Michiel
dc.contributor.authorKaczer, Ben
dc.contributor.authorBury, Erik
dc.contributor.authorFranco, Jacopo
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorMakarov, Alexander
dc.contributor.authorMertens, Hans
dc.contributor.authorHellings, Geert
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2023-08-08T12:12:29Z
dc.date.available2023-07-15T17:05:29Z
dc.date.available2023-07-31T10:13:51Z
dc.date.available2023-08-08T12:12:29Z
dc.date.issued2023-05-15
dc.identifier.issn1541-7026
dc.identifier.otherWOS:001007431500148
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42148.3
dc.sourceWOS
dc.titleInvestigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations
dc.typeProceedings paper
dc.contributor.imecauthorVandemaele, Michiel
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorBury, Erik
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorMakarov, Alexander
dc.contributor.imecauthorMertens, Hans
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecVandemaele, Michiel::0000-0003-0740-4115
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecBury, Erik::0000-0002-5847-3949
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecMakarov, Alexander::0000-0002-9927-6511
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecGroeseneken, Guido::0000-0003-3763-2098
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.date.embargo2023-05-15
dc.identifier.doi10.1109/IRPS48203.2023.10118211
dc.identifier.eisbn978-1-6654-5672-2
dc.source.numberofpages10
dc.source.peerreviewyes
dc.subject.disciplineElectrical & electronic engineering
dc.source.beginpage2A.1-1
dc.source.endpage2A.1-10
dc.source.conference61st IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 26-30, 2023
dc.source.conferencelocationMonterey
dc.source.journal2023 IEEE International Reliability Physics Symposium (IRPS)
imec.availabilityPublished - open access
dc.description.wosFundingTextThe work of Michiel Vandemaele was supported by the Ph.D. Fellowship of the Research Foundation-Flanders (Belgium) (application numbers 11A3619N and 11A3621N). Michiel Vandemaele gratefully acknowledges fruitful discussions with Kai-Hsin Chuang, Zlatan Stanojevic and Stanislav Tyaginov.


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320.500.12860/42148.3*2023-08-08T12:09:17Zvalidation by library/open access desk
220.500.12860/42148.22023-07-31T10:00:25Zvalidation by imec author
120.500.12860/421482023-07-15T17:05:29Z

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