dc.contributor.author | Coenen, David | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Degraeve, Robin | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2023-08-09T13:03:51Z | |
dc.date.available | 2023-08-04T17:07:06Z | |
dc.date.available | 2023-08-07T13:11:22Z | |
dc.date.available | 2023-08-09T13:03:51Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0278-0070 | |
dc.identifier.other | WOS:001017411600015 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42267.3 | |
dc.source | WOS | |
dc.title | Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits | |
dc.type | Journal article | |
dc.contributor.imecauthor | Coenen, David | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Degraeve, Robin | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Coenen, David::0000-0002-3732-1874 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Degraeve, Robin::0000-0002-4609-5573 | |
dc.date.embargo | 2023-07-31 | |
dc.identifier.doi | 10.1109/TCAD.2022.3216549 | |
dc.source.numberofpages | 12 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2264 | |
dc.source.endpage | 2275 | |
dc.source.journal | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | |
dc.source.issue | 7 | |
dc.source.volume | 42 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | & nbsp;This work was supported in part by the IMEC's Industry Affiliation Research and Development Program "Optical I/O" and in part by the IMEC's Expertise Center Advanced Reliability, Robustness, andTest (AR2T). | |