Publication:

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits

Date

2023
Journal article
https://doi.org/10.1109/tcad.2022.3216549
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

Published version 7.19 MB
Accepted version 3.6 MB

Author(s)

Coenen, David  
;
Oprins, Herman  
;
Degraeve, Robin  
;
De Wolf, Ingrid  

Journal

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

Abstract

Description

Statistics

Downloads

760 since deposited on 2023-08-04
31last month
8last week
Acq. date: 2026-10-05

Views

1152 since deposited on 2023-08-04
2last month
Acq. date: 2026-10-05

Citations

Statistics

Downloads

760 since deposited on 2023-08-04
31last month
8last week
Acq. date: 2026-10-05

Views

1152 since deposited on 2023-08-04
2last month
Acq. date: 2026-10-05

Citations