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Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits
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Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits
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Date
2023
Journal article
https://doi.org/10.1109/TCAD.2022.3216549
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7.19 MB
Accepted version
3.6 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Coenen, David
;
Oprins, Herman
;
Degraeve, Robin
;
De Wolf, Ingrid
Journal
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
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Downloads
476
since deposited on 2023-08-04
64
last month
9
last week
Acq. date: 2025-12-15
Views
1132
since deposited on 2023-08-04
1
last month
Acq. date: 2025-12-15
Citations