Publication:

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits

Date

2023
Journal article
https://doi.org/10.1109/TCAD.2022.3216549
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dc.contributor.authorCoenen, David
dc.contributor.authorOprins, Herman
dc.contributor.authorDegraeve, Robin
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorCoenen, David
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecCoenen, David::0000-0002-3732-1874
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecDegraeve, Robin::0000-0002-4609-5573
dc.date.accessioned2023-08-09T13:03:51Z
dc.date.available2023-08-04T17:07:06Z
dc.date.available2023-08-07T13:11:22Z
dc.date.available2023-08-09T13:03:51Z
dc.date.embargo2023-07-31
dc.date.issued2023
dc.description.wosFundingText& nbsp;This work was supported in part by the IMEC's Industry Affiliation Research and Development Program "Optical I/O" and in part by the IMEC's Expertise Center Advanced Reliability, Robustness, andTest (AR2T).
dc.identifier.doi10.1109/TCAD.2022.3216549
dc.identifier.issn0278-0070
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42267
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage2264
dc.source.endpage2275
dc.source.issue7
dc.source.journalIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
dc.source.numberofpages12
dc.source.volume42
dc.subject.keywordsCOMPACT
dc.subject.keywordsMODEL
dc.title

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits

dc.typeJournal article
dspace.entity.typePublication
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