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Improving uniformity of 3-level High Aspect Ratio Supervias

dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorMarien, Philippe
dc.contributor.authorHermans, Yannick
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorFeurprier, Y.
dc.contributor.authorOikawa, N.
dc.contributor.authorBuccheri, Nunzio
dc.contributor.authorWu, Chen
dc.contributor.authorMartinez Alanis, Gerardo Tadeo
dc.contributor.authorBatuk, Dmitry
dc.contributor.authorPuliyalil, Harinarayanan
dc.contributor.authorDecoster, Stefan
dc.contributor.authorKumar, K.
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2024-05-23T11:54:00Z
dc.date.available2023-08-07T17:07:23Z
dc.date.available2024-05-23T11:54:00Z
dc.date.issued2023
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001027381700031
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42287.2
dc.sourceWOS
dc.titleImproving uniformity of 3-level High Aspect Ratio Supervias
dc.typeProceedings paper
dc.contributor.imecauthorMontero Alvarez, Daniel
dc.contributor.imecauthorMarien, Philippe
dc.contributor.imecauthorHermans, Yannick
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorBuccheri, Nunzio
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorMartinez Alanis, Gerardo Tadeo
dc.contributor.imecauthorBatuk, Dmitry
dc.contributor.imecauthorPuliyalil, Harinarayanan
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecMontero Alvarez, Daniel::0000-0001-9966-0399
dc.contributor.orcidimecMarien, Philippe::0000-0001-5644-4442
dc.contributor.orcidimecHermans, Yannick::0000-0002-6973-0795
dc.contributor.orcidimecVega Gonzalez, Victor::0000-0002-4320-0585
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecMartinez Alanis, Gerardo Tadeo::0000-0001-5036-0491
dc.contributor.orcidimecBatuk, Dmitry::0000-0002-6384-6690
dc.contributor.orcidimecPuliyalil, Harinarayanan::0000-0002-9749-5307
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.identifier.doi10.1109/IITC/MAM57687.2023.10154787
dc.identifier.eisbn979-8-3503-1097-9
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedateMAY 22-25, 2023
dc.source.conferencelocationDresden
dc.source.journalN/A
imec.availabilityPublished - imec


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220.500.12860/42287.2*2024-05-23T10:36:53Zvalidation by library/open access desk
120.500.12860/422872023-08-07T17:07:23Z

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